TOKYO, June 30 (Bernama-BUSINESS WIRE) -- Toshiba Corporation's (TOKYO:6502) Storage & Electronic Devices Solutions Company today announced the launch of "TLP5832," a new gate driver photocoupler housed in a low-height SO8L package. It delivers 2.5A peak output power and can directly drive medium-class IGBTs. Shipments start today.
Adoption of the SO8L package realizes an IC approximately 54% lower in height than Toshiba’s current products in SDIP6 and DIP8 (LF1 option) packages, providing support for mounting on boards with limited mounting height and also contributing to downsizing of sets. In spite of its small size, the IC secures minimum creepage and a clearance distance of at least 8mm, making it suitable for applications requiring high insulation performance.
Adoption of the SO8L package realizes an IC approximately 54% lower in height than Toshiba’s current products in SDIP6 and DIP8 (LF1 option) packages, providing support for mounting on boards with limited mounting height and also contributing to downsizing of sets. In spite of its small size, the IC secures minimum creepage and a clearance distance of at least 8mm, making it suitable for applications requiring high insulation performance.
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